AI算力（GB200/300）AI computing power
理解頂級算力，才能提供頂級散熱。AI的競賽，也是散熱技術的競賽，當前正處于從風冷到液冷歷史性轉換的臨界點。GB200/300作為高度集成的系統，其散熱需求已從單一的芯片級，擴展到芯片、內存、NVLink互連模塊、供電模塊等多個高熱源的整體協同散熱。
Only by understanding top-tier computing power can we deliver top-tier thermal management. The race for AI supremacy is also a race for thermal management technology, and we are currently at a historic turning point in the transition from air cooling to liquid cooling. As highly integrated systems, the GB200/300 series now require thermal management that extends beyond a single chip to encompass the coordinated cooling of multiple high- heat-generating components, including the chip, memory, NVLink interconnect modules and power delivery modules.
